AS 60068.2.69-2004

1 Scope2 Normative references3 General description of the method4 Description of the test apparatus5 Preconditioning 5.1 Preparation of specimens 5.2 Materials 5.2.1 Solder 5.2.2 Flux6 Procedures 6.1 Test temperature 6.2 Solder bath wetting balance procedure 6.3 Solder globule wetting balance procedure7 Presentation of results 7.1 Form of force versus time trace 7.2 Test requirements8 Information to be given in the relevant specificationAnnex A (normative) - Equipment specificationAnnex B (normative) - Use of the wetting balance for SMD solderability testing

Part of a suite of Standards that adopt the IEC 60068 series of Standards as Australian Standards. The series contains fundamental information on environmental testing procedures and severities of tests, including information on atmospheric conditions for measurement and testing. Although primarily intended for electrotechnical products, many of the environmental testing procedures are equally applicable to other industrial products.

This International Standard describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.The terms used in this standard are those defined in IEC 60068-2-20 and IEC 60068-2-54.

First published as AS 60068.2.69-2004.