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Status of Standard is Unknown
BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
Available format(s)
Hardcopy , PDF
Language(s)
English
Publisher
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1 Scope
2 Normative references
3 Terms, definitions and symbols
4 The signs
5 Essential elements and feature
6 Measurement methods
7 Test methods of the reliability
BS EN 60747-14-6 ED 1.0.
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
34
|
| PublisherName |
British Standards Institution
|
| Status |
NA
|
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-17:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation |
| IEC 60749-8:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| IEC 60749-31:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) |
| IEC 60749-1:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General |
| IEC 60749-29:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
| IEC 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| IEC 60749-36:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state |
| IEC 60749-18:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) |
| IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
| IEC 60749-16:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) |
| IEC 60749-9:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
| IEC 60749-33:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave |
| IEC 60749-24:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
| IEC 60721-2-1:2013 | Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity |
| IEC 60747-14-1:2010 | Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC 60721-3-0:1984+AMD1:1987 CSV | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction |
| IEC 60749-35:2006 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components |
| IEC 60749-7:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60749-13:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere |
| IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| IEC 60749-2:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure |
| ISO/IEC Guide 2:2004 | Standardization and related activities — General vocabulary |
| IEC 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60749-32:2002+AMD1:2010 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) |
| IEC 60749-14:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
| IEC 60749-19:2003+AMD1:2010 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength |
| IEC 60749-22:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength |
| IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
| IEC 60721-3-1:1997 | Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage |
| IEC 60749-23:2004+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
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