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09/30210900 DC : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

BS EN 61249-2-40 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY

Available format(s)

Hardcopy , PDF

Superseded date

04-30-2013

Superseded by

BS EN 61249-2-40:2013

Language(s)

English

US$26.05
Excluding Tax where applicable

1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical Properties
6 Non-Electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
   complete removal of the copper foil
8 Quality assurance
9 Packaging and marking
10 Ordering information
Annex A (informative) - Engineering information
Annex B (informative) - Common laminate constructions
Annex C (informative) - Guideline for qualification and
        conformance inspection

BS EN 61249-2-40

Committee
EPL/501
DocumentType
Draft
Pages
25
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
ISO 14001:2015 Environmental management systems — Requirements with guidance for use
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
ISO 11014:2009 Safety data sheet for chemical products Content and order of sections
ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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