09/30201707 DC : 0
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
Available format(s)
Hardcopy , PDF
Superseded date
07-31-2010
Superseded by
Language(s)
English
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.BS EN 60664-3+A1 ED.2
| Committee |
GEL/109
|
| DocumentType |
Draft
|
| Pages |
9
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 60454-3-1:1998+AMD1:2001 CSV | Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC GUIDE 104:2010 | The preparation of safety publications and the use of basic safety publications and group safety publications |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60664-5:2007 | Insulation coordination for equipment within low-voltage systems - Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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