07/30164973 DC : 0
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EN 61249-2-31 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-31: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
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Hardcopy , PDF
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English
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Important note : All end users must be registered with an Account prior to user licenses being assigned.EN 61249-2-31
| Committee |
EPL/501
|
| DocumentType |
Draft
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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