PD IEC/TR 62866:2014
Current
Current
The latest, up-to-date edition.
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
07-05-2014
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
96
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
| Standards | Relationship |
| IEC TR 62866:2014 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-3-6:2001 | Environmental testing - Part 3-6: Supporting documentation and guidance - Confirmation of the performance of temperature/humidity chambers |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| MIL-HDBK-781 Revision A:1996 | RELIABILITY TEST METHODS, PLANS, AND ENVIRONMENTS FOR ENGINEERING DEVELOPMENT, QUALIFICATION AND PRODUCTION |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| ISO 4677-1:1985 | Atmospheres for conditioning and testing Determination of relative humidity Part 1: Aspirated psychrometer method |
| IPC TR 476 : A1997 | ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES |
| IEC 60068-3-5:2001 | Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers |
| ISO 9455-17:2002 | Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IPC 9201 : A | SURFACE INSULATION RESISTANCE HANDBOOK |
| MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
| ASQ Z1.9:2003 (R2013) | Sampling Procedures And Tables For Inspection By Variables For Percent Nonconforming |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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