MIL-STD-1605 Revision A:2009
Current
The latest, up-to-date edition.
Procedures for Conducting a Shipboard Electromagnetic Interference (EMI) Survey (Surface Ship)
08-10-2009
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES
Specifies the procedures for demonstrating compliance with the intra and inter-system electromagnetic compatibility (EMC), hull-generated Intermodulation Interference (IMI), and electrical bonding requirements of MIL-STD-464 for naval surface ships.
| DevelopmentNote |
A NOTICE 1 - Notice of Validation. (08/2014)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
This standard provides the procedures for demonstrating compliance with the intra and inter-system electromagnetic compatibility (EMC), hull-generated Intermodulation Interference (IMI), and electrical bonding requirements of MIL-STD-464 for naval surface ships. In addition, an EMI survey is required for new construction ships and ships receiving overhauls or other major repair work that changes the ships electromagnetic configuration.
| MIL-STD-464 Revision C:2010 | ELECTROMAGNETIC ENVIRONMENTAL EFFECTS REQUIREMENTS FOR SYSTEMS |
| IEEE 1709-2010 | IEEE Recommended Practice for 1 kV to 35 kV Medium-Voltage DC Power Systems on Ships |
| ANEP-45 : 0 | |
| IEEE/ANSI C63.14-2014 REDLINE | American National Standard Dictionary of Electromagnetic Compatibility (EMC) including Electromagnetic Environmental Effects (E3) |
| MIL-STD-464 Revision C:2010 | ELECTROMAGNETIC ENVIRONMENTAL EFFECTS REQUIREMENTS FOR SYSTEMS |
| MIL-STD-1310 Revision H:2009 | SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY |
| IEEE/ANSI C63.14-2014 REDLINE | American National Standard Dictionary of Electromagnetic Compatibility (EMC) including Electromagnetic Environmental Effects (E3) |
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