JIS C 6481:1996
Current
The latest, up-to-date edition.
Test methods of copper-clad laminates for printed wiring boards
Hardcopy , PDF
English, Japanese
31-01-1996
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This Japanese Industrial Standard specifies test methods of copper-clad laminates for printed wiring boards (hereafter referred to as "copper-clad laminates").
| DocumentType |
Test Method
|
| Pages |
52
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2015 96(R2015) [20/10/2015]96(R2010) [01/10/2010]96(R2001) [20/09/2001]96 [01/01/1996]90 [01/10/1990]86
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| JIS C 6489:1999 | Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test) |
| JIS C 6488:1999 | Base materials for printed circuits - Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test) |
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| JIS C 6485:1997 | Copper-clad laminates for printed wiring boards - Paper base, phenolic resin |
| JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
| JIS C 6493:1999 | Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board |
| JIS C 6483:1997 | Copper-clad laminates for printed wiring boards - Synthetic fiber fabric base, epoxy resin |
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| JIS C 6494:1999 | Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards |
| JIS C 6490:1998 | Base materials for printed circuits - Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
| JIS C 6492:1998 | Base materials for printed circuits - Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
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