IPC WP/TR 584 : A
Current
The latest, up-to-date edition.
IPC WHITE PAPER AND TECHNICAL REPORT ON THE USE OF HALOGENATED FLAME RETARDANTS IN PRINTED CIRCUIT BOARDS AND ASSEMBLIES
Hardcopy
English
19-09-2007
Specifies the IPC position on the subject of 'halogen free' materials for the electronics industry. Applicable to materials for interconnecting electronics including but not limited to copper-clad laminates and prepregs, resin coated copper foils, flexible materials and soldermasks.
| Committee |
4-30
|
| DevelopmentNote |
Included in IPC C 107. (06/2008) Included in IPC C 105 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
33
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IEC PAS 63015:2016 | Definition of "Low-Halogen" for electronic products |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
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