IPC TR 001 : 1989
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
AN INTRODUCTION TO TAPE AUTOMATED BONDING FINE PITCH TECHNOLOGY
Available format(s)
Hardcopy
Superseded date
13-09-2023
Superseded by
Language(s)
English
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.Represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008)
|
| DocumentType |
Technical Report
|
| Pages |
38
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC SMC WP 003 : 1993 | CHIP MOUNTING TECHNOLOGY (CMT) |
| IPC SMC WP 001 : 1991 | SOLDERING CAPABILITY WHITE PAPER REPORT |
| IPC WP 004 : 1997 | DESIGN FOR SUCCESS |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
| IPC SMC WP 005 : 1997 | PWB SURFACE FINISHES |
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