IPC SM 784 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION
Hardcopy
28-01-2013
English
Intended to be an aid to the provider or user of chip on board technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through hole mount to surface mount and on to the finer pitch of chip on board technology.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008)
|
| DocumentType |
Standard
|
| Pages |
53
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| IPC J STD 013 : 0 | IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IPC J STD 026 : 0 | SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
| IPC J STD 026 : 0 | SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC M 103 : LATEST | STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
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