IPC J STD 032 : 0
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
PERFORMANCE STANDARD FOR BALL GRID ARRAY BALLS
14-09-2023
1 SCOPE
1.1 Purpose
1.2 Intent
1.3 Terms and Definitions
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 General Performance Requirements
3.2 Classes of Ball Grid Array Joints
3.3 Mechanical Requirements
3.4 Electrical Parameters
3.5 Metallurgical/Chemical Requirements
4 CONSTRUCTION OF BGA BALLS
4.1 Physical Characteristics
Appendix A NORMATIVE TERMINOLOGY
Appendix B ACRONYMS
Defines the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages.
| DevelopmentNote |
Jointly published by IPC & EIA. (01/2018)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
| IPC J STD 013 : 0 | IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
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