IPC J STD 028 : 0
Current
The latest, up-to-date edition.
PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
Hardcopy
English
01-08-1999
Determines construction detail requirements for bumps and other terminal structures used for Flip Chip and Chip Scale carriers. Matches defined standards for differing terminations to a particular interconnection process; includes solder bumps, columns, non-melting stand-offs and conductive polymer deposits.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008) Jointly published by IPC & EIA. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
60
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| BS EN 62258-1:2010 | Semiconductor die products Procurement and use |
| I.S. EN 62258-1:2010 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| IPC SM 784 : 0 | GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
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| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IPC J STD 027 : 0 | MECHANICAL OUTLINE STANDARD FOR FLIP CHIP AND CHIP SIZE CONFIGURATIONS |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IPC J STD 026 : 0 | SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC SM 784 : 0 | GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
| IPC J STD 026 : 0 | SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
| IEC PAS 62084:1998 | Implementation of flip chip and chip scale technology |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IEC PAS 62085:1998 | Implementation of ball grid array and other high density technology |
| IPC WP 003 : 1993 | CHIP MOUNTING TECHNOLOGY (CMT) |
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