IPC CM 770 : E

1 SCOPE
   1.1 Purpose
   1.2 Classification of Board Types and Assemblies
   1.3 Order of Precedence
   1.4 Presentation
   1.5 Terms and Definitions
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
   2.3 Electronic Industries Association
   2.4 EOS/ESD Association Documents
   2.5 JEDEC
3 GENERAL GUIDELINES
   3.1 Design Options and Considerations
   3.2 Assembly Considerations
   3.3 Materials
   3.4 Handling and Storage
   3.5 Material Movement Systems
4 COMPONENT GUIDELINES
   4.1 Component Characterization and Classes
   4.2 Component Packaging/Delivery Systems
   4.3 Lead/Termination Finishes
5 PACKAGING AND INTERCONNECTING (PRINTED BOARD) STRUCTURES
   5.1 Printed Board Characterization and Classes
   5.2 Supporting-Plane Printed Board Structures
   5.3 Constraining Core Printed Board Structures
   5.4 Other Mounting Structure Materials and Considerations
6 ASSEMBLY DESIGN CYCLE
   6.1 Types of Assembly Operations
   6.2 Soldering Operations
   6.3 Assembly Sequence
   6.4 Mass Attachment Properties
   6.5 Environment (Nitrogen)
7 PLACEMENT GUIDELINES
   7.1 Placement Technology
   7.2 Design Checks
   7.3 Specification and Procurement of Components
   7.4 Specification and Procurement of Printed Boards
   7.5 Specifications and Procurement of Process Materials
8 INTERCONNECT TECHNOLOGY
   8.1 Component Spacing
   8.2 Single and Double-Sided Board Assembly
   8.3 Component Standoff Height for Cleaning
   8.4 Fiducial Marks
   8.5 Conductors
   8.6 Via Guidelines
   8.7 Standard Fabrication Allowances
   8.8 Board Size and Panelization
9 COMPONENT CHARACTERISTICS THROUGH-HOLE
   9.1 Axial-Leaded Discrete Components
   9.2 Radial-Leaded Discrete Components
   9.3 Multiple-Radial-Lead Components
   9.4 Inline Packages
   9.5 Ribbon-Lead Components
   9.6 Pin Grid Array Components
   9.7 Through-Hole Mount Connectors
   9.8 Through-Hole Sockets
10 MOUNTING STRUCTURE REQUIREMENTS THROUGH-HOLE
   10.1 Printed Board Characterization and Types
11 ASSEMBLY SEQUENCE THROUGH-HOLE
   11.1 Process Steps
   11.2 Component Placement
   11.3 Vertical Mounting
   11.4 Mixed Technology
   11.5 Manual Techniques
   11.6 Automated Techniques
12 COMPONENT CHARACTERISTICS SURFACE MOUNT
   12.1 Characterization and Classes
   12.2 Component Procurement
   12.3 Handling and Storage
   12.4 Chip Resistors
   12.5 Chip Capacitors
   12.6 Inductors
   12.7 Tantalum Capacitors
   12.8 Metal Electrode Face (MELF) Components
   12.9 SOT 23
   12.10 SOT 89
   12.11 SOD 123
   12.12 SOT 143
   12.13 SOT 223
   12.14 TO 252/TO 268
   12.15 SOIC
   12.16 SOP
   12.17 SOJ
   12.18 PLCC (Square)
   12.19 PLCC (Rectangular)
   12.20 LCC
13 MOUNTING STRUCTURE GUIDELINES SURFACE MOUNT
   13.1 Printed Board Characterization and Types
   13.2 Organic Rigid, Organic Flex and Rigid-Flex
   13.3 Land Patterns
   13.4 Tolerance Analysis
   13.5 Alternative Printed Board Structures
   13.6 Surface Preparation
   13.7 Gold on Printed Board Surface Mount Lands
   13.8 Printed Board Condition
14 SURFACE MOUNT
   14.1 Assembly Hierarchy
   14.2 Manual Techniques
   14.3 Automated Assembly Techniques
15 COMPONENT CHARACTERISTICS HIGH PIN COUNT AREA ARRAY
   15.1 Component Definition
   15.2 Component Packaging Style Considerations
   15.3 BGA Connectors
   15.4 Components Package Drawings
   15.5 Component Procurement
   15.6 Handling and Storage
16 MOUNTING STRUCTURE REQUIREMENTS HIGH PIN COUNT AREA ARRAY
   16.1 Characterization and Classes - Interconnecting
         Structures (Printed Boards)
   16.2 Standardization
   16.3 Ball Pitch
   16.4 Future Ball Conditions
   16.5 Land Approximation
   16.6 Physical Conditions
17 ASSEMBLY HIERARCHY HIGH PIN COUNT AREA ARRAY
   17.1 Process Steps
   17.2 Process Step Analysis
   17.3 Attachment Issues
   17.4 Reflow
   17.5 Preclad
18 COMPONENT CHARACTERISTICS FLIP CHIP DIRECT CHIP ATTACH
   18.1 Types of Flip Chip Joints
   18.2 Characterization and Classes of Flip Chip Joints
   18.3 Component Design for Circuit Boards
   18.4 Handling, Shipping and Storage
   18.5 Mechanical Properties
   18.6 Electrical Issues
   18.7 Marking
   18.8 Physical Conditions
19 MOUNTING STRUCTURE GUIDELINES FLIP CHIP DIRECT CHIP
   ATTACH (Refer to General Guidelines Section)
20 ASSEMBLY HIERARCHY FLIP CHIP DIRECT CHIP ATTACH
   20.1 Process Steps
   20.2 Manual Techniques for Semiautomated Pick and Place
   20.3 Automated Techniques
   20.4 Single Point Attachment
   20.5 Mass Attachment Properties
21 CLEANING
   21.1 General Considerations
   21.2 Cleanliness Assessment
   21.3 Post-Soldering Cleaning
22 ELECTRICAL TEST CONSIDERATIONS
   22.1 Five Types of Testing
   22.2 Nodal Access
   22.3 Full Nodal Access for Assembled Board
   22.4 Limited Nodal Access
   22.5 No Nodal Access
   22.6 Clam-Shell Fixtures Impact
   22.7 Printed Board Test Characteristics
23 QUALITY ASSURANCE
   23.1 Relationship to Test/Inspection
   23.2 Standard Magnification
   23.3 Process Control
   23.4 Process Verification Inspection
24 PERFORMANCE/RELIABILITY EVALUATIONS
   24.1 Relationships to Test and Quality Assurance
25 REPAIR/REWORK
   25.1 Reuse of Components
   25.2 Heat Sinking Effects
   25.3 Dependence on Printed Board Material Type
   25.4 Dependence on Copper Land and Conductor Layout
   25.5 Selection of Suitable Rework Equipment
   25.6 Dependence on Assembly Structure and
         Soldering Processes
26 COATING AND ENCAPSULATION
   26.1 Conformal Coating
   26.2 Encapsulation
27 DOCUMENTATION
   27.1 Drawing Requirements
   27.2 Electronic Data Transfer
   27.3 Specifications
   27.4 Printed Board Assembly Documentation Process Flow
   27.5 Documentation for SMT

Gives effective guidelines in the preparation of components for printed wiring board assembly and reviews pertinent design criteria, impacts and issues. Contains techniques for assembly (both manual and machines including SMT and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes.