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IPC CF 152 : B

Current

Current

The latest, up-to-date edition.

COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS

Available format(s)

Hardcopy

Language(s)

English

Published date

01-12-1997

1 SCOPE
  1.1 Purpose
  1.2 Designation
  1.3 Presentation
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 American Society for Testing Materials
  2.3 Military Standards
3 REQUIREMENTS
  3.1 Terms and Definitions
  3.2 General Requirements - Acceptability
  3.3 Visual
  3.4 Dimensional
  3.5 Physical Requirements
  3.6 Processing Requirements - Treated Composite Foils
4 QUALITY ASSURANCE PROVISIONS
  4.1 Quality Conformance Evaluations
  4.2 Classification of Inspections
  4.3 Qualification Inspection
  4.4 Quality Conformance Inspection
  4.5 Test Methods
  4.6 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
  5.1 Shipping Requirements
  5.2 Documentation
  5.3 Marking
6 NOTES
  6.1 Ordering Data
  6.2 References
APPENDIX 1
1 Overlay Volume Ratio
  1.A A Chemical Etch Method to Determine Copper Invar
      Copper Foil Ratio
  1.B Overlay Thickness Ratio for Copper/Invar/Copper
      Metal Core
2 Determination of Coefficient of Thermal Expansion
  (CTE) Method
  2.B Fixturing of Thin Strip/Foil Materials for CTE
      Measurements
Figures

Covers the requirements for copper/invar/copper and copper/molybdenum/copper, and three-layer composite materials. Lists visual (pits,dents,wrinkles), dimensional (width, length, thickness), physical (tensile, elongation, bow and twist) and bond integrity requirements. Includes slash sheets and test methods.

DevelopmentNote
Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008)
DocumentType
Standard
Pages
34
PublisherName
Institute of Printed Circuits
Status
Current

IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
IPC TR 482 : 1976 NEW DEVELOPMENTS IN THIN COPPER FOILS
IPC TR 484 : 1986 RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC MI 660 : 1984 INCOMING INSPECTION OF RAW MATERIALS MANUAL
IPC 4101 CHINESE : C2009 SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 4101 GERMAN : C SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
I.S. EN 16602-70-11:2015 SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS
IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
EN 16602-70-11:2015 Space product assurance - Procurement of printed circuit boards
BS EN 16602-70-11:2015 Space product assurance. Procurement of printed circuit boards
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6013 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC M 107 : LATEST STANDARDS FOR PRINTED BOARD MATERIALS MANUAL
IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
IPC TR 484 : 1986 RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM

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