IPC 9708 : 0
Current
The latest, up-to-date edition.
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
Hardcopy
English
14-12-2010
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1 SCOPE
2 APPLICABLE DOCUMENTS
3 TEST METHODS
4 REFERENCES
Specifies test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (12/2010) Also available in Chinese language, See IPC 9708 CHINESE. (07/2013)
|
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
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