IPC 9631 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION
Hardcopy
15-05-2016
English
1 EXECUTIVE SUMMARY
2 APPLICABLE DOCUMENTS
3 HISTORICAL BACKGROUND
4 PRECONDITIONING CONSIDERATIONS
5 PROFILE DEVELOPMENT/OVEN SETUP
6 PROFILE VERIFICATION
7 PHYSICS OF METHOD 2.6.27
8 SUMMARY
Specifies how the test method is intended for use and the rationale behind some of the protocols and requirements.
| DevelopmentNote |
Included in IPC C 1000. (12/2010) Also available in German Language, See IPC 9631 GERMAN. (04/2013)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 7530 : 0 | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE) |
| IPC 1601 : 0 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
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