IPC-7095E:2024
Current
Current
The latest, up-to-date edition.
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
Available format(s)
Hardcopy
Language(s)
English
Published date
09-12-2024
Publisher
The IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-486-1
|
| Pages |
208
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
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