IPC-7095D-WAM1:2018/AMD 1:2019
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Design and Assembly Process Implementation for BGAs, with Amendment 1
Hardcopy
25-01-2025
English - Chinese, Japanese
01-06-2019
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.
| DocumentType |
Amendment
|
| ISBN |
978-1-951577-22-3
|
| Pages |
0
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
Important note : All end users must be registered with an Account prior to user licenses being assigned.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.
Logging out.