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IPC-7095D:2018

IPC-7095D:2018

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

Amended by

IPC-7095D-WAM1:2018/AMD 1:2019

Superseded date

25-01-2025

Superseded by

IPC-7095E:2024

Published date

22-02-2019

Publisher

Institute of Printed Circuits

This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages

DocumentType
Standard
ProductNote
New Child AMD1 is Added
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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