IPC 7094A : 2018
Current
Current
The latest, up-to-date edition.
IPC-7094A: Design and Assembly Process Implementation for Flip Chip and Die-Size Components - English
Available format(s)
Hardcopy
Language(s)
English
Published date
01-01-2018
Publisher
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-327-7
|
| Pages |
92
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
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