IPC 4562 : A
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
METAL FOIL FOR PRINTED BOARD APPLICATIONS
Hardcopy
12-04-2024
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1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
APPENDIX A - Copper Foil Application Guidelines
Covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in printed boards. Metal foils shall be considered acceptable, so long as the requirements in this specification are met, unless otherwise agreed between the supplier and the user.
| DevelopmentNote |
Supersedes IPC MF 150 and IPC CF 150. (12/2001) Included in IPC C 102, IPC C 107, IPC C 105 & IPC C 1000. (07/2008) Also available in Chinese Language, See IPC 4562 CHINESE. (07/2012) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| Pages |
41
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| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| IPC 2222 GERMAN : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2222 FRENCH : A2010 | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2223 CHINESE : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC A 600 SWEDISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 JAPANESE : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 CHINESE : G | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC A 600 GERMAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| IPC A 600 POLISH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC A 600 RUSSIAN : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 2222 CHINESE : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
| IPC 4204 CHINESE : A2011 AMD 1 2013 | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC TR 482 : 1976 | NEW DEVELOPMENTS IN THIN COPPER FOILS |
| IPC 2223 GERMAN : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC A 600 FRENCH : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 4101 CHINESE : C2009 | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| PPP-B-1672 Revision E:2013 | BOXES, SHIPPING, REUSABLE WITH CUSHIONING |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC 4101 GERMAN : C | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| I.S. EN 16602-70-12:2016 | SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ISO/IEC 17025:2005 | General requirements for the competence of testing and calibration laboratories |
| IPC D 330 : 1992 | DESIGN GUIDE MANUAL |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| ANSI/NCSL Z540 1 : 94(R2002) | CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS |
| IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
| IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
| ISO 10012-1:1992 | Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
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