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IPC 4556 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS

Superseded date

23-07-2013

Superseded by

IPC 4556 : 2013

1 SCOPE
2 APPLICABLE DOCUMENTS AND TERMS AND DEFINITIONS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
APPENDIX 1 - Chemical Definitions and Process
             Sequence
APPENDIX 2 - Round Robin Test Summary
APPENDIX 3 - ENEPIG PWB Surface Finish XRF Round
             Robin Testing
APPENDIX 4 - Factors Affecting Measurement Accuracy
             of ENEPIG Coatings by XRF
APPENDIX 5 - ENEPIG PWB Surface Finish Wetting
             Balance Testing
APPENDIX 6 - Solder Spread Testing
APPENDIX 7 - ENEPIG PWB Surface Finish Shear Test
             Project
APPENDIX 8 - Gold Wire Bonding
APPENDIX 9 - XRF Thickness Measurements of thin
             Au and Pd (ENEPIG): Recommendations
             for Instrumentation (Detectors) and
             their Limitations
APPENDIX 10 - Gage Capability. Gage R&R Type 1 Study
APPENDIX 11 - Solderability Testing Helps Select
              Surface Finishes

Defines the requirements for the use of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a surface finish for printed boards.

DevelopmentNote
Also available in CD-ROM format. (02/2013)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
ASTM B 733 : 2015 : REDLINE Standard Specification for Autocatalytic (Electroless) Nickel-Phosphorus Coatings on Metal
MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
GR 1217 CORE : ISSUE 2 GENERIC REQUIREMENTS FOR SEPARABLE ELECTRICAL CONNECTORS USED IN TELECOMMUNICATIONS HARDWARE
MIL-C-28859 Revision B:1990 CONNECTOR COMPONENT PART, ELECTRICAL BACK PLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR
ASTM B 845 : 1997 Standard Guide for Mixed Flowing Gas (MFG) Tests for Electrical Contacts
IPC TM 650 : 0 TEST METHODS MANUAL
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
ISO 4527:2003 Metallic coatings — Autocatalytic (electroless) nickel-phosphorus alloy coatings — Specification and test methods
IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
MIL-STD-1580 Revision B:2003 DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC 6013 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 5704 : 0 CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS

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