IPC 1072 : 2015 AMD 1 2017
Current
The latest, up-to-date edition.
INTELLECTUAL PROPERTY PROTECTION IN ELECTRONIC ASSEMBLY MANUFACTURING
Hardcopy
English
01-03-2017
1 SCOPE
2 APPLICABLE DOCUMENTS
3 TERMS AND DEFINITIONS
4 ELECTRONIC MANUFACTURING SERVICES
(EMS) BEST PRACTICES
Describes printed circuit board assemblers in development of requirements for the protection of intellectual property (IP) for their customers in commercial, industrial and military and other high-reliability markets.
| Committee |
E-20
|
| DevelopmentNote |
Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-295-9
|
| Pages |
16
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 1071 : A | INTELLECTUAL PROPERTY PROTECTION IN PRINTED BOARD MANUFACTURING |
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