IPC 1066 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD-FREE AND OTHER REPORTABLE MATERIALS IN LEAD-FREE ASSEMBLIES, COMPONENTS AND DEVICES
Hardcopy
01-05-2007
English
1 SCOPE
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 IEC
2.3 European Parliament
2.4 AIM
3 TERMS AND DEFINITIONS
3.1 2[nd] Level Interconnect
3.2 2[nd] Level Interconnect Label
3.3 Bar Code Label
3.4 RoHS
3.5 Halogen-Free
3.6 Pb-Free (Lead-Free)
3.7 Pb-Free Category
3.8 Pb-Free Identification Label
3.9 Pb-Free Symbol
4 LABELS AND SYMBOLS
5 LABELING CATEGORIES
5.1 Solder Finish Categories
5.2 Resin Category
5.3 Conformal Coating Categories
6 COMPONENT MARKING
6.1 Size
6.2 Color
6.3 Font
6.4 Maximum Safe Assembly Temperature
7 PRINTED CIRCUIT BOARD/ASSEMBLY MARKING
7.1 Category Hierarchy
7.2 Location
7.3 Color
7.4 Size
7.5 Method
7.6 Marking Sequence
7.7 Repair Marking
8 SYMBOL AND LABELS
8.1 Pb-Free Symbol
8.2 Pb-Free Identification Label
8.2.1 Size
8.2.2 Color
8.3 2nd Level Interconnect Label
8.3.1 Components
8.3.2 Assemblies
8.3.3 Size
8.3.4 Color
Figures
Establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (pb-free) and are capable of providing Pb-free 2[nd] level interconnects, and for indicating certain types of Pb-free materials and the maximum allowable soldering temperatures.
| DevelopmentNote |
Included in Manuals IPC M 104 & IPC M 106 (12/2004)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| PD IEC/TS 62564-1:2016 | Process management for avionics. Aerospace qualified electronic components (AQEC) Integrated circuits and discrete semiconductors |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IPC E3TOOL : LATEST | E3 SURVIVAL TOOLKIT |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| DD IEC TS 62564-1 : DRAFT SEP 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
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