IPC 1066 : 0

1 SCOPE
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 IEC
  2.3 European Parliament
  2.4 AIM
3 TERMS AND DEFINITIONS
  3.1 2[nd] Level Interconnect
  3.2 2[nd] Level Interconnect Label
  3.3 Bar Code Label
  3.4 RoHS
  3.5 Halogen-Free
  3.6 Pb-Free (Lead-Free)
  3.7 Pb-Free Category
  3.8 Pb-Free Identification Label
  3.9 Pb-Free Symbol
4 LABELS AND SYMBOLS
5 LABELING CATEGORIES
  5.1 Solder Finish Categories
  5.2 Resin Category
  5.3 Conformal Coating Categories
6 COMPONENT MARKING
  6.1 Size
  6.2 Color
  6.3 Font
  6.4 Maximum Safe Assembly Temperature
7 PRINTED CIRCUIT BOARD/ASSEMBLY MARKING
  7.1 Category Hierarchy
  7.2 Location
  7.3 Color
  7.4 Size
  7.5 Method
  7.6 Marking Sequence
  7.7 Repair Marking
8 SYMBOL AND LABELS
  8.1 Pb-Free Symbol
  8.2 Pb-Free Identification Label
      8.2.1 Size
      8.2.2 Color
  8.3 2nd Level Interconnect Label
      8.3.1 Components
      8.3.2 Assemblies
      8.3.3 Size
      8.3.4 Color
Figures

Establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (pb-free) and are capable of providing Pb-free 2[nd] level interconnects, and for indicating certain types of Pb-free materials and the maximum allowable soldering temperatures.