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IEC TS 61340-5-2:1999

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

14-08-2007

Language(s)

English - French, Spanish, Castilian

Published date

26-02-1999

£266.90
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Signs and markings - General
   4.1 Markings
        4.1.1 ESDS marking
        4.1.2 Packaging marking
        4.1.3 Equipment marking
   4.3 Signs for ESD protected areas (EPA)
5 ESD protected area (EPA) - General
   5.1 Configuration
        5.1.1 General
        5.1.3 High-voltage EPA
   5.2 Requirements for specific ESD protective items
        5.2.1 General
        5.2.2 Working surfaces and storage racks
        5.2.3 Floors
        5.2.4 Seating
        5.2.5 Garments
        5.2.6 Gloves and finger cots
        5.2.7 Wrist strap
        5.2.8 Footwear
        5.2.9 Ionisers
        5.2.10 Tools, machinery, dispensers and test equipment
        5.2.11 Trolleys and carts
   5.3 Construction of an EPA
        5.3.1 General
        5.3.2 EPA ground facility
        5.3.3 EPA ground bonding point (EBP)
        5.3.4 EPA ground cords
        5.3.5 Electrostatic fields
        5.3.6 Certification of conformance
   5.4 Field work
   5.5 EPA working practices
6 Protective packaging
7 Purchase, receipt, storage and handling
   7.1 General
   7.2 Purchase
   7.3 Receipt and storage
   7.4 Unpacking, inspection and storage within an EPA
8 Training
   8.1 Relevant structured training ESD
   8.2 Personnel training
   8.4 Items for consideration in training
   8.5 Retraining
   8.6 Register of trained personnel
   8.7 Training provided by the ESD co-ordinator
   8.8 Training officer qualification
9 Quality responsibilities
   9.1 Responsibilities
   9.2 ESD co-ordinator
   9.3 Procurement of ESD protective items
   9.4 Checking of electrostatic precautions
   9.6 Daily checks
        9.6.1 Visual daily check
        9.6.2 Wrist straps
        9.6.3 Non-permanent footwear
   9.7 Monthly checks
   9.8 Six-monthly checks
        9.8.1 General
        9.8.2 Electrostatic fields
        9.8.3 Signs and labels
10 Periodic audit instructions
   10.1 Table 1 of IEC 61340-5-1 - ESD protective item
        requirements
   10.2 Table 2 of IEC 61340-5-1 - Packaging
        characteristics
   10.3 Table 3 of IEC 61340-5-1 - Example of audit
        report (summary)
   10.4 Table 4 of IEC 61340-5-1 - EPA equipment list
Annex A (normative) Test methods
      A.1 - Resistance measurement method for the testing of
            floor, working surface or storage rack
      A.2 - Resistance measurement method for the testing of
            seating
      A.3 - Resistance measurement method for the testing of
            garments
      A.5 - Wrist straps, footwear, gloves, finger cots and
            tools
      A.6 - Test method and equipment for ionisation
      A.7 - Test method for evaluating the performance of
            electrostatic discharge shielding material -
            Bags
Annex B (informative) Test methods for charge decay
      B.1 - Method of measurement of charge decay
Annex C (informative) Design considerations to minimise the
                      effects of ESD
      C.1 - Identification
      C.3 - Design of electrostatic discharge sensitive
            devices (ESDS)
      C.4 - Design of assemblies
      C.5 - Packaging design
      C.6 - System design
      C.7 - Design evaluation procedure
Annex DD (informative) Principles and methods of controlling
                       static electricity
      DD.1 - Methods
      DD.2 - Principles
Annex EE (informative) Principles of relationship between
                       charge, charge density, field and
                       potential
      EE.1 - Insulated conducting body
      EE.2 - Insulating body
Annex FF (informative) Bibliography
Figure 101 - Maximum body voltage generated against resistance

Covers the protection from electrostatic discharge (ESD) damage of all electronic devices (components, assemblies and sub-assemblies) with voltage sensitivity of not lower than 100 V throughout their entire life. This is from the commencement of manufacture, through product assembly, product use and possible repair until the end of the product life. Is to be read in conjunction with IEC 61340-5-1.

DevelopmentNote
To be read in conjunction with IEC 61340-5-1 (11/2001)
DocumentType
Technical Specification
Pages
109
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

03/317589 DC : 0 IEC 61340-5-1 ED.2 - ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
13/30286163 DC : 0 BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS
04/30110525 DC : DRAFT MARCH 2004 IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
BS EN 61760-2:2007 Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide
07/30152286 DC : 0
CEI EN 61760-2 : 2008 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
06/30155852 DC : DRAFT SEP 2006 BS EN 60286-3-6 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: TYPE 6 - PACKAGING OF SURFACE MOUNT COMPONENTS ON BLISTER CARRIER TAPES 4 MM IN WIDTH
PD CLC/TR 62258-3:2007 Semiconductor die products Recommendations for good practice in handling, packing and storage
I.S. CLC TS 50466:2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
BS EN 60747-16-1 : 2002 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
I.S. EN 60747-16-1:2002 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
CEI CLC/TS 50466 : 2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
I.S. CLC/TR 62258-3:2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EIA 4899 : 2001 STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
OVE/ONORM EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
07/30169405 DC : 0 BS EN 60747-16-3 AMD1 - SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
BS PD IEC 62239 : 2001 ELECTRONIC COMPONENT MANAGEMENT PLANS
DD CLC/TS 50466:2006 Long duration storage of electronic components. Specification for implementation
IEC PAS 62239:2001 Electronic component management plans
CEI EN 60747-16-1 : 2009 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
BS PD IEC TR 62258-3 : 2005 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
05/30139061 DC : DRAFT SEP 2005 IEC 60286-3 - PACKING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
BS IEC 61340-5.1 : 1998 AMD 13198 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
07/30169412 DC : 0 BS EN 60747-16-4 AMD1 - SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
I.S. EN 61760-2:2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
EN 60747-16-1:2002/A2:2017 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017)
IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC TS 60479-1:2005+AMD1:2016 CSV Effects of current on human beings and livestock - Part 1: Generalaspects
IEC 61340-4-1:2003+AMD1:2015 CSV Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors
IEC 61010-1:2010+AMD1:2016 CSV Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements

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