IEC 61193-3:2013
Current
Current
The latest, up-to-date edition.
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
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Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
24-01-2013
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Sampling methodologies
5 Classification of attributes
6 Defects and process deviation indicator
(PDI) evaluation
7 Inspection plans
8 Classification of defects
9 Percent defectives per million opportunities
10 Use of sampling plans
Annex A (informative) - Example of consensus sampling
plan for three levels of conformance to requirements
of IEC 62326-4 multilayer printed boards
Annex B (informative) - Example of consensus sampling plan
Annex C (informative) - Operating characteristics curves
and values
Bibliography
IEC 61193-3:2013 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit the use of different sampling plans that may be applied to an individual attribute or set of attributes, according to classification of importance with regard to form, fit and function.
| Committee |
TC 91
|
| DevelopmentNote |
Stability date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
136
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| GOST R IEC 61193-3 : 2015 | Identical |
| NF EN 61193-3 : 2013 | Identical |
| NEN EN IEC 61193-3 : 2013 | Identical |
| PN EN 61193-3 : 2013 | Identical |
| BS EN 61193-3:2013 | Identical |
| CEI EN 61193-3 : 2014 | Identical |
| EN 61193-3:2013 | Identical |
| DIN EN 61193-3:2013-11 | Identical |
| SN EN 61193-3:2013 | Identical |
| PNE-FprEN 61193-3 | Identical |
| UNE-EN 61193-3:2013 | Identical |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| ISO 3951-1:2013 | Sampling procedures for inspection by variables — Part 1: Specification for single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection for a single quality characteristic and a single AQL |
| ISO 2859-4:2002 | Sampling procedures for inspection by attributes Part 4: Procedures for assessment of declared quality levels |
| ISO 2859-3:2005 | Sampling procedures for inspection by attributes — Part 3: Skip-lot sampling procedures |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| ISO 2859-2:1985 | Sampling procedures for inspection by attributes — Part 2: Sampling plans indexed by limiting quality (LQ) for isolated lot inspection |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| ISO 14560:2004 | Acceptance sampling procedures by attributes Specified quality levels in nonconforming items per million |
| ISO 21247:2005 | Combined accept-zero sampling systems and process control procedures for product acceptance |
| ISO 8422:2006 | Sequential sampling plans for inspection by attributes |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 8423:2008 | Sequential sampling plans for inspection by variables for percent nonconforming (known standard deviation) |
| ISO 2859-10:2006 | Sampling procedures for inspection by attributes Part 10: Introduction to the ISO 2859 series of standards for sampling for inspection by attributes |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 13448-1:2005 | Acceptance sampling procedures based on the allocation of priorities principle (APP) Part 1: Guidelines for the APP approach |
| ISO 13448-2:2004 | Acceptance sampling procedures based on the allocation of priorities principle (APP) Part 2: Coordinated single sampling plans for acceptance sampling by attributes |
| ISO 3951-3:2007 | Sampling procedures for inspection by variables Part 3: Double sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection |
| ISO 18414:2006 | Acceptance sampling procedures by attributes Accept-zero sampling system based on credit principle for controlling outgoing quality |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| ISO 11014:2009 | Safety data sheet for chemical products Content and order of sections |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61249-2-34:2009 | Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad |
| ISO 24153:2009 | Random sampling and randomization procedures |
| ISO 3951-5:2006 | Sampling procedures for inspection by variables Part 5: Sequential sampling plans indexed by acceptance quality limit (AQL) for inspection by variables (known standard deviation) |
| ISO 2859-5:2005 | Sampling procedures for inspection by attributes — Part 5: System of sequential sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| ISO 3951-2:2013 | Sampling procedures for inspection by variables — Part 2: General specification for single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection of independent quality characteristics |
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