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I.S. EN 62878-1-1:2015

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS

Available format(s)

Hardcopy , PDF

Superseded date

09-01-2020

Language(s)

English

Published date

01-01-2015

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

£70.17
Excluding VAT

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test methods
5 Shipping inspection
Annex A (informative) - Related test methods
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines the test methods of passive and active device embedded substrates.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
122
PublisherName
National Standards Authority of Ireland
Status
Superseded

Standards Relationship
EN 62878-1-1:2015 Identical

IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC 62421:2007 Electronics assembly technology - Electronic modules
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
ISO 3366:1999 Coated abrasives Abrasive rolls
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
ISO 4957:1999 Tool steels
IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 60068-2-64:2008 Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance
IEC 60068-2-53:2010 Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests
ISO 15184:2012 Paints and varnishes Determination of film hardness by pencil test
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
ISO 6906:1984 Vernier callipers reading to 0,02 mm
ISO 29864:2007 Self adhesive tapes Measurement of breaking strength and elongation at break
ISO 9180:1988 Black leads for wood-cased pencils Classification and diameters
ISO 6353-3:1987 Reagents for chemical analysis — Part 3: Specifications — Second series
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
ISO 29863:2007 Self adhesive tapes Measurement of static shear adhesion
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
ISO 29862:2007 Self adhesive tapes Determination of peel adhesion properties
ISO 3599:1976 Vernier callipers reading to 0,1 and 0,05 mm
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
ISO 8512-1:1990 Surface plates — Part 1: Cast iron
ISO 291:2008 Plastics Standard atmospheres for conditioning and testing
IEC 60068-2-80:2005 Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode
ISO 3611:2010 Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
ISO 8512-2:1990 Surface plates — Part 2: Granite
ISO 21948:2001 Coated abrasives Plain sheets
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
ISO 2409:2013 Paints and varnishes Cross-cut test
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
ISO 9445-1:2009 Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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