EN 62047-18:2013
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
27-09-2013
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| CEI EN 62047-18 : 2014 | Identical |
| IEC 62047-18:2013 | Identical |
| NEN EN IEC 62047-18 : 2013 | Identical |
| I.S. EN 62047-18:2013 | Identical |
| SN EN 62047-18:2013 | Identical |
| BS EN 62047-18:2013 | Identical |
| NBN EN 62047-18 : 2013 | Identical |
| PN EN 62047-18 : 2014 | Identical |
| NF EN 62047-18 : 2014 | Identical |
| UNE-EN 62047-18:2013 | Identical |
| DIN EN 62047-18:2014-04 | Identical |
| PNE-FprEN 62047-18 | Identical |
| IEC 62047-6:2009 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
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