DIN EN 60068-2-69 : 2007
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
Available format(s)
Hardcopy
Superseded date
16-01-2018
Superseded by
Language(s)
German
Published date
01-01-2007
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.| DevelopmentNote |
Supersedes DIN IEC 60068-2-69. (11/2007) Supersedes DIN EN 60068-2-54. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
27
|
| PublisherName |
Verband Deutscher Elektrotechniker
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-69:2017 | Identical |
| I.S. EN 60068-2-69:2017 | Identical |
| SN EN 60068-2-69 : 2017 | Identical |
| BS EN 60068-2-69:2017 | Identical |
| UNE-EN 60068-2-69:2007 | Identical |
| VDE 0468-2-69 : 2018 | Corresponds |
| EN 60068-2-69:2017/AC:2018-03 | Identical |
| DIN EN 60068-4:1996-10 | ENVIRONMENTAL TESTING - PART 4: INFORMATION FOR SPECIFICATION WRITERS - TEST SUMMARIES |
| DIN DVS HDBK 196 : 4ED 2001 | SCHWEISSTECHNIK 5 - HARTLOETEN, WEICHLOETEN, GEDRUCKTE SCHALTUNGEN |
| DIN EN 60068-2-2 : 1995 | ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| DIN EN 60068-2-20:2009-02 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008 |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| VDE 0468-1 : 2015 | Environmental testing Part 1: General and guidance (IEC 60068-1:2013) |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| VDE 0468-2-2 : 2008 | ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| DIN EN 60068-1 : 2015 | ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013) |
| DIN EN 61190-1-3:2015-05 (Draft) | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-3-13:2016 | Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| DIN EN 60068-2-66:1995-06 | ENVIRONMENTAL TESTING - TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR) |
| EN 60068-2-66:1994 | Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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