IPC 2315 : 0
Current
Current
The latest, up-to-date edition.
DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS
Available format(s)
Hardcopy
Language(s)
English
Published date
01-06-2000
Publisher
Published jointly with the Japan Printed Circuit Association, this document gives an easy to follow tutorial on the selection of HDI and microvia design structures and rules.
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| IPC 6801 : 0 | IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC HDI 1 : LATEST | HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
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