IEC 62374-1:2010
Current
The latest, up-to-date edition.
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
29-09-2010
FOREWORD
1 Scope
2 Terms and definitions
3 Test equipment
4 Test samples
5 Procedures
6 Lifetime estimation
7 Lifetime dependence on inter-metal layer area
8 Summary
Annex A (informative) - Engineering supplementation
for lifetime estimation
Bibliography
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Committee |
TC 47
|
DevelopmentNote |
Stability Date: 2020. (09/2017)
|
DocumentType |
Standard
|
Pages |
36
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
NF EN 62374-1 : 2011 | Identical |
NEN EN IEC 62374-1 : 2010 C11 2011 | Identical |
I.S. EN 62374-1:2010 | Identical |
UNE-EN 62374-1:2010 | Identical |
BS EN 62374-1:2010 | Identical |
CEI EN 62374-1 : 2012 | Identical |
EN 62374-1:2010/AC:2011 | Identical |
DIN EN 62374-1:2011-06 | Identical |
PNE-FprEN 62374-1 | Identical |
IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.