MIL-PRF-32560 Base Document:2016
NA
Status of Standard is Unknown
COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION INSPECTION
APPENDIX B - ALTERNATE INDUCTANCE & QUALITY FACTOR (Q) &
SELF-RESONANT FREQUENCY (SRF) MEASUREMENT PROCEDURES
Specifies the general requirements for established reliability (ER) fixed, radio frequency surface mount coils.
Committee |
FSC 5950
|
DevelopmentNote |
NEW CHILD NOT 1 2021 IS NOW ADDED.
|
DocumentType |
Standard
|
Pages |
34
|
ProductNote |
NEW CHILD NOT 1 2021 IS NOW ADDED.
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
NA
|
MIL-PRF-32560-5 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED, ESTABLISHED RELIABILITY, SURFACE MOUNT |
MIL-PRF-32560-4 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, UNSHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
MIL-PRF-32560-2 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
MIL-PRF-32560-1 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, CONFORMAL COATED, ESTABLISHED RELIABILITY, SURFACE MOUNT |
MIL-PRF-32560-6 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, OPEN CONSTRUCTION ESTABLISHED RELIABILITY, SURFACE MOUNT, 0603 SIZE |
MIL-PRF-32560-3 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, UNSHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
ANSI/NCSL Z540 3 : 2006(R2013) | REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT |
MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
MIL-STD-202-303 Base Document:2015 | Method 303, DC Resistance |
IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
MIL-STD-790 Revision G:2011 | ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS |
ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
MIL-STD-690 Revision D:2005 | Failure Rate (FR) Sampling Plans and Procedures |
MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
MIL-STD-202-213 Base Document:2015 | Method 213, Shock (Specified Pulse) |
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