BS EN 60749-26:2014

1 Scope
2 Normative references
3 Terms and definitions
4 Apparatus and required equipment
5 Stress test equipment qualification
  and routine verification
6 Classification procedure
7 Failure criteria
8 Component classification
Annex A (informative) - HBM test method flow chart
Annex B (informative) - HBM test equipment parasitic
        properties
Annex C (informative) - Example of testing a product
        using Table 2, Table 3, or Table 2 with a
        two-pin HBM tester
Annex D (informative) - Examples of coupled
        non-supply pin pairs
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Specifies the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels.

ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected.