SEMI T7 : 2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL
11-05-2022
12-01-2013
Specifies the geometric shape, size and content (including the error checking and correcting code) of a rectangular two-dimensional (2-D), machine-readable, binary data matrix code symbol for back surface marking of double-side polished silicon wafers with diameters of 300 mm and 450 mm that comply with SEMI M1.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Superseded
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| SupersededBy |
| SEMI M8 : 2012 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS |
| SEMI M49 : 2016 | GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS |
| SEMI M38 : 2012(R2018) | SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS |
| SEMI T3 : 2013 | SPECIFICATION FOR WAFER BOX LABELS |
| SEMI M76 : 2010 | SPECIFICATION FOR DEVELOPMENTAL 450 MM DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS |
| SEMI M24 : 2007 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS |
| SEMI M1 : 2017 | SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS |
| SEMI 3D16 : 2016 | SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING |
| SEMI M74 : 2008(R2018) | SPECIFICATION FOR 450 MM DIAMETER MECHANICAL HANDLING POLISHED WAFERS |
| SEMI T14 : 2005 | SPECIFICATION FOR MICRO ID ON 300 MM SILICON WAFERS |
| SEMI E174 : 2017 | SPECIFICATION FOR WAFER JOB MANAGEMENT (WJM) |
| SEMI T17 :2006(R2018) | SPECIFICATION OF SUBSTRATE TRACEABILITY |
| SEMI E118 : NOV 2004E | SPECIFICATION FOR WAFER ID READER COMMUNICATION INTERFACE - THE WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE |
| NASA STD 6002 : 2008 | APPLYING DATA MATRIX IDENTIFICATION SYMBOLS ON AEROSPACE PARTS |
| NASA HDBK 6003 : 2008 | APPLICATION OF DATA MATRIX IDENTIFICATION SYMBOLS TO AEROSPACE PARTS USING DIRECT PART MARKING METHODS/TECHNIQUES |
| SEMI M62 : 2017 | SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS |
| SEMI 3D2 : 2016 | SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS |
| SEMI M57 : 2016 | SPECIFICATION FOR SILICON ANNEALED WAFERS |
| SEMI PV81 : 2018 | GUIDE FOR SPECIFYING LOW PRESSURE HORIZONTAL DIFFUSION FURNACE |
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