NF EN 61190-1-3 : 2008 AMD 1 2010
Current
Current
The latest, up-to-date edition.
Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
Amendment of
Published date
13-07-2018
Publisher
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| DevelopmentNote |
Indice de classement: C90-700-1-3PR. (11/2002) PR NF EN 61190-1-3 February 2006. (02/2006) PR NF EN 61190-1-3 November 2017. (12/2017)
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| DocumentType |
Standard
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| PublisherName |
Association Francaise de Normalisation
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| Status |
Current
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| Standards | Relationship |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Identical |
| BS EN 61190-1-3 : 2007 | Identical |
| I.S. EN 61190-1-3:2007 | Identical |
| DIN EN 61190-1-3:2015-05 (Draft) | Identical |
| EN 61190-1-3:2007/A1:2010 | Identical |
| NF EN 62025-2 : 2005 | HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS |
| NF EN 62137-1-5 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
| NF EN 61189-5 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| NF EN 62137-1-4 : 2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST |
| NF EN 61189-6 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
| NF EN 61190-1-2 : 2014 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| NF EN 60194 : 2006 | PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| NF EN ISO 9454-2 : 2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| NF EN 61190-1-1 : 2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| NF EN ISO 9453 : 2014 | SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9001:2015 | Quality management systems — Requirements |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| NF EN 2199454-1 : 1994 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING |
| NF EN ISO 9001 : 2015 | QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS |
| NF EN 61189-5 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
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