
NEN NPR IEC/TR 62866 : 2014
Current
Current
The latest, up-to-date edition.

ELECTROCHEMICAL MIGRATION IN PRINTED WIRING BOARDS AND ASSEMBLIES - MECHANISMS AND TESTING
Published date
27-05-2014
Publisher
Explains the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
DocumentType |
Standard
|
PublisherName |
Netherlands Standards
|
Status |
Current
|
Standards | Relationship |
IEC TR 62866:2014 | Identical |
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