NEN EN IEC 62137-1-4 : 2009
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SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
Published date
12-01-2013
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Applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. It also evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
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| Status |
Current
|
| Standards | Relationship |
| IEC 62137-1-4:2009 | Identical |
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