NASA KSC STD 132 : 2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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POTTING AND MOLDING ELECTRICAL CABLE ASSEMBLY TERMINATIONS, STANDARD FOR
01-08-2024
01-01-2008
1. SCOPE
2. APPLICABLE DOCUMENTS
2.1 Government Specifications
2.2 Government Standards
2.3 Government Drawings
2.4 Order of Preference
3. DEFINITIONS
4. GENERAL REQUIREMENTS
4.1 Materials
4.1.1 Epoxy
4.1.2 Elastomeric
4.1.3 Storage Life of Materials
4.2 Configuration and Dimensions
4.3 Equipment
4.3.1 Vacuum Chamber
4.3.2 Mixing Containers
4.3.3 Air-Pressurization Equipment
4.3.4 Brushes
4.3.5 Weighing Equipment
4.3.6 Holding Rack
4.3.7 Injection Gun
4.3.8 Cable Molds
4.3.9 Thermometer
4.3.10 Abrasive Paper
4.3.11 Metal Spatula
4.3.12 Hot Plate
4.3.13 Curing Apparatus
5. DETAILED REQUIREMENTS
5.1 Facilities
5.1.1 Molding and Potting Area
5.1.2 Ventilating
5.1.3 Environmental Conditions
5.1.4 Cleanliness
5.1.5 Health and Safety Precautions
5.1.6 Inspection
5.1.7 Personnel
5.2 Preparation for Potting and Molding
5.2.1 Preparation of Cable Assemblies
5.2.2 Preparation of Connectors
5.2.3 Preparation of Cable
5.2.4 Potting Setup
5.2.5 Mold Preparation
5.2.6 Molding Setup
5.3 Preparation of Compounds
5.3.1 Epoxy Potting Compounds
5.3.2 Preparation of Elastomeric Compounds
5.4 Potting Instructions
5.4.1 Inspection
5.4.2 Injection
5.4.3 Curing
5.4.4 Inspection After Curing
5.4.5 Repair
5.5 Molding Instructions
5.5.1 Inspection
5.5.2 Injection
5.5.3 Curing
5.5.4 Inspection After Curing
5.6 Repair and Rework
5.6.1 Repairable Defects
5.6.2 Rework Procedure
5.6.3 Inspection
5.7 Reports
6. NOTES
6.1 Intended Use
APPENDIX A - ILLUSTRATIONS
Specifies a standard process for potting and molding electrical cable assembly terminations using epoxy-resin potting compositions and elastomeric dielectric compounds. Also describes the materials and methods to be used in potting and molding electrical cable assembly terminations with epoxy-resin potting compositions and elastomeric dielectric compounds and describes the facilities and equipment required to perform the potting and molding processes.
DocumentType |
Standard
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PublisherName |
National Aeronautics and Space Administration
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Status |
Superseded
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SupersededBy | |
Supersedes |
NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
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NASA STD 5005 : 2013 | STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
NASA KSC STD E 0001 : 2008 | DESIGN OF ELECTRICAL CONTROL AND MONITORING SYSTEMS, EQUIPMENT (GSE), AND PANELS, STANDARD FOR |
NASA KSC TM 584 : 1994 | CORROSION CONTROL AND TREATMENT MANUAL |
NASA KSC GP 864 VOL 2A : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT CABLE HANDBOOK |
NASA KSC STD E 0004 : 2008 | PNEUMATIC AND HYDRAULIC MECHANICAL COMPONENTS, ELECTRICAL DESIGN, STANDARD FOR |
NASA KSC GP 986 : 1993 | DESIGN CRITERIA FOR REUSABLE SPACE VEHICLE UMBILICAL SYSTEMS |
MIL-DTL-5015 Revision H:2000 | CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE - GENERAL SPECIFICATION FOR |
NASA KSC SPEC E 0029 : 1972 | COMPOUND, POTTING AND MOLDING ELASTOMERIC, SPECIFICATION FOR |
NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
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MIL-DTL-22992 Revision H:2015 | Connectors, Plugsand Receptacles, Electrical, Waterproof, Quick Disconnect, Heavy Duty Type, General Specification for |
ASTM D 4080 : 2015 : REDLINE | Standard Specification for Trichloroethylene, Technical and Vapor-Degreasing Grade |
MIL-DTL-38999 Revision M:2015 | Connectors, Electrical, Circular, Miniature, High Density, Quick Disconnect (Bayonet, Threaded or Breech Coupling), Environment Resistant with Crimp Removable Contacts or Hermetically Sealed with Fixed, Solderable Contacts, General Specification for |
SAE AMS DTL 23053 : 1999 | INSULATION SLEEVING, ELECTRICAL, HEAT SHRINKABLE, GENERAL SPECIFICATION FOR |
MIL-STD-171 Revision F:2011 | FINISHING OF METAL AND WOOD SURFACES |
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