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MIL-STD-202-208 Base Document:2015

NA

NA

Status of Standard is Unknown

Method 208, Solderability

Available format(s)

PDF

Language(s)

English

Published date

18-04-2015

£15.36
Excluding VAT

FOREWORD
1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES

Establishes the solderability of all terminations which are normally joined by a soldering operation.

DocumentType
Standard
Pages
6
PublisherName
US Military Specs/Standards/Handbooks
Status
NA

The purpose of this test method is to determine the solderability of all terminations which are normally joined by a soldering operation. This determination is made on the basis of the ability of these terminations to be wetted by solder and the predictability of a suitable fillet resulting from solder application. These procedures will verify that the pre-assembly lead finish provides a solderable surface of sufficient quality to enable satisfactory soldering.

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IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
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