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MIL-DTL-55302-27 Revision K:2008

Current

Current

The latest, up-to-date edition.

CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, 30 THRU 140 CONTACT POSITIONS, FOR PRINTED WIRING BOARDS (.100 SQ. GRID)

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PDF

£15.36
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Committee
FSC 5935
DevelopmentNote
Supersedes MIL C 55302/27 (H). (01/2004) K NOTICE 1 - Notice of Validation. (04/2013)
DocumentType
Standard
Pages
27
PublisherName
US Military Specs/Standards/Handbooks
Status
Current
Supersedes

MIL-DTL-55302-110 Revision H:2006 Connectors, Printed Circuit Subassembly and Accessories: Plug, Right Angle, 30 Thru 140 Contact Positions, For Printed Wiring Boards (.100 Sq. Grid)
MIL-DTL-55302-113 Revision F:2006 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, STRAIGHT-THRU, 30 THRU 110 CONTACT POSITIONS, CRIMP REMOVABLE CONTACTS (.100 SQ. GRID)
MIL-DTL-55302-32 Revision G:2004 Connectors, Printed Circuit Subassembly and Accessories: Contacts, Solder Eyelet and Wrappost Removable Types
MIL-STD-1353 Revision C:2014 ELECTRICAL CONNECTORS, PLUG-IN SOCKETS AND ASSOCIATED HARDWARE, SELECTION AND USE OF
MIL-DTL-55302-31 Revision L:2007 Connectors, Printed Circuit Subassembly and Accessories: Keying Accessories
MIL-DTL-55302-26 Revision G:2008 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, 30 THRU 140 CONTACT POSITIONS, FOR PRINTED WIRING BOARDS (.100 SQ. GRID)

MIL-DTL-55302-26 Revision G:2008 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, 30 THRU 140 CONTACT POSITIONS, FOR PRINTED WIRING BOARDS (.100 SQ. GRID)
MIL-DTL-55302 Revision G:2009 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
MIL-DTL-55302-32 Revision G:2004 Connectors, Printed Circuit Subassembly and Accessories: Contacts, Solder Eyelet and Wrappost Removable Types
MIL-DTL-55302-30 Revision B:2003 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: TEST PROBE FIXTURE FOR RESISTANCE TO TEST PROBE DAMAGE
MIL-DTL-55302-110 Revision H:2006 Connectors, Printed Circuit Subassembly and Accessories: Plug, Right Angle, 30 Thru 140 Contact Positions, For Printed Wiring Boards (.100 Sq. Grid)
MIL-DTL-55302-29 Revision B:2003 Connectors, Printed Circuit Subassembly and Accessories: Gage for Contact Separation Force Test Method
ASTM D 5138 : 2016 : REDLINE Standard Classification System and Basis for Specification for Liquid Crystal Polymers Molding and Extrusion Materials (LCP)
MIL-DTL-55302-31 Revision L:2007 Connectors, Printed Circuit Subassembly and Accessories: Keying Accessories
MIL-M-24519 Revision E:1992 MOLDING PLASTICS, POLYESTER AND POLYARYLETHER THERMOPLASTIC

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