IEC 62137-4:2014
Current
The latest, up-to-date edition.
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
09-10-2014
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FOREWORD
1 Scope
2 Normative references
3 Terms definitions and abbreviations
4 General
5 Test apparatus and materials
6 Specimen preparation
7 Temperature cycling test
8 Temperature cycling life
9 Items to be specified in the relevant product
specification
Annex A (informative) - Acceleration of the temperature
cycling for solder joints
Annex B (informative) - Electrical continuity test for
solder joints of the package
Annex C (informative) - Reflow solderability test method
for package and test substrate land
Annex D (informative) - Test substrate design guideline
Annex E (informative) - Heat resistance to reflow soldering
for test substrate
Annex F (informative) - Pull strength measurement method
for the test substrate land
Annex G (informative) - Standard mounting process for the
packages
Annex H (informative) - Mechanical stresses to the packages
Bibliography
IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.
| Committee |
TC 91
|
| DevelopmentNote |
Supersedes IEC 62137. Stability date: 2017. (10/2014)
|
| DocumentType |
Standard
|
| Pages |
85
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 62137-4 : 2015 | Identical |
| NBN EN 62137-4 : 2015 COR 2015 | Identical |
| NEN EN IEC 62137-4 : 2015 C11 2015 | Identical |
| PN EN 62137-4 : 2015 | Identical |
| BS EN 62137-4:2014 | Identical |
| CEI EN 62137-4 : 2016 | Identical |
| EN 62137-4:2014/AC:2015 | Identical |
| DIN EN 62137-4:2015-07 | Identical |
| JIS C 62137-4:2016 | Identical |
| UNE-EN 62137-4:2014 | Identical |
| PNE-FprEN 62137-4 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 61188-5-8:2007 | Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| IEC 60749-1:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| IEC 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| IEC 60191-6-2:2001 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| IEC 61249-2-8:2003 | Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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