IEC 62137-1-2:2007
Current
The latest, up-to-date edition.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
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English, English - French
25-07-2007
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
5.1 Shear test equipment
5.2 Pushing tool
5.3 Optical microscope
5.4 Scanning electron microscope (SEM)
5.5 Reflow soldering oven
5.6 Test substrate
5.7 Solder alloy
5.8 Solder paste
6 Mounting method
7 Test conditions
7.1 Test: Rapid change of temperature
7.2 Shear strength test
8 Test procedure
8.1 Test sequence
8.2 Pre-conditioning
8.3 Initial shear strength
8.4 Rapid change of temperature
8.5 Recovery
8.6 Intermediate/final shear strength
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Shear strength test - Details
Bibliography
The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
| Committee |
TC 91
|
| DevelopmentNote |
A Bilingual edition has been published. (05/2008) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 62137-1-2 : 2014 | Identical |
| NEN EN IEC 62137-1-2 : 2007 | Identical |
| I.S. EN 62137-1-2:2007 | Identical |
| PN EN 62137-1-2 : 2008 | Identical |
| UNE-EN 62137-1-2:2007 | Identical |
| BS EN 62137-1-2:2007 | Identical |
| CEI EN 62137-1-2 : 2008 | Identical |
| EN 62137-1-2:2007 | Identical |
| DIN EN 62137-1-2:2008-02 | Identical |
| JIS C 62137-1-2:2010 | Identical |
| PNE-prEN 62137-1-2 | Identical |
| BS EN 62137-3:2012 | Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| 09/30206176 DC : DRAFT JUNE 2009 | BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| IEC PAS 62137-3:2008 | Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints |
| DD IEC PAS 62137-3 : DRAFT 2008 | ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| BS EN 62321-2:2014 | Determination of certain substances in electrotechnical products Disassembly, disjointment and mechanical sample preparation |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| CEI EN 62137-3 : 2012 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| I.S. EN 62137-3:2012 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV)) |
| I.S. EN 62321-2:2014 | DETERMINATION OF CERTAIN SUBSTANCES IN ELECTROTECHNICAL PRODUCTS - PART 2: DISASSEMBLY, DISJOINTMENT AND MECHANICAL SAMPLE PREPARATION |
| EN 62321-2:2014 | Determination of certain substances in electrotechnical products - Part 2: Disassembly, disjointment and mechanical sample preparation |
| EN 62137-3:2012 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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