IEC 61189-11:2013
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
07-05-2013
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting
temperatures of solder alloys
Annex B (informative) - Examples of test
result (Method A)
Annex C (informative) - Example of test
result (Method B)
Bibliography
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
| Committee |
TC 91
|
| DevelopmentNote |
Stability date: 2020. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61189-11 : 2011 PR | Identical |
| NEN EN IEC 61189-11 : 2013 | Identical |
| PN EN 61189-11 : 2013 | Identical |
| BS EN 61189-11:2013 | Identical |
| CEI EN 61189-11 : 2014 | Identical |
| EN 61189-11 : 2013 | Identical |
| DIN EN 61189-11:2014-02 | Identical |
| SN EN 61189-11:2013 | Identical |
| UNE-EN 61189-11:2013 | Identical |
| PNE-FprEN 61189-11 | Identical |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
| IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| ISO 11357-1:2016 | Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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