IEC 60749-40:2011
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
13-07-2011
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Test procedure
6 Test method
7 Summary
Annex A (normative) - Drop impact test method using test rod
Annex B (informative) - An example of strain gauge attachment
procedure
IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
| DevelopmentNote |
Stability Date: 2015. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
44
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60749-40 : 2012 | Identical |
| NBN EN 60749-40 : 2011 | Identical |
| NEN EN IEC 60749-40 : 2011 | Identical |
| I.S. EN 60749-40:2011 | Identical |
| PN EN 60749-40 : 2012 | Identical |
| BS EN 60749-40:2011 | Identical |
| CEI EN 60749-40 : 2012 | Identical |
| EN 60749-40 : 2011 | Identical |
| DIN EN 60749-40:2012-02 | Identical |
| PNE-FprEN 60749-40 | Identical |
| UNE-EN 60749-40:2011 | Identical |
| I.S. EN 60749-37:2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| CEI EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| IEC 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
| BS EN 60749-37:2008 | Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer |
| EN 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
| IEC 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
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