IEC 60749-37:2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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12-10-2022
English - French
30-01-2008
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FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
4.1 Test apparatus
4.2 Test components
4.3 Test board
4.4 Test board assembly
4.5 Number of components and sample size
5 Test procedure
5.1 Test equipment and parameters
5.2 Pre-test characterization
5.3 Drop testing
6 Failure criteria and failure analysis
7 Summary
Annex A (informative) Preferred board construction,
material, design and layout
Bibliography
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62050. (02/2008) Stability Date: 2021. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| DS EN 60749-37 : 2008 | Identical |
| NF EN 60749-37 : 2008 | Identical |
| NEN EN IEC 60749-37 : 2008 | Identical |
| I.S. EN 60749-37:2008 | Identical |
| PN EN 60749-37 : 2008 | Identical |
| BS EN 60749-37:2008 | Identical |
| CEI EN 60749-37 : 2008 | Identical |
| EN 60749-37:2008 | Identical |
| DIN EN 60749-37:2008-08 | Identical |
| OVE/ONORM EN 60749-37 : 2008 | Identical |
| UNE-EN 60749-37:2008 | Identical |
| PNE-prEN 60749-37 | Identical |
| 04/30119207 DC : DRAFT AUG 2004 | IEC 60747-20-1 - SEMICONDUCTOR DEVICES - PART 20-1: HANDLING, PACKING, LABELLING, SHIPPING AND USE OF MOISTURE REFLOW SENSITIVE SURFACE MOUNT DEVICES |
| I.S. EN 60749-40:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| EN 60749-40 : 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| 09/30190356 DC : 0 | BS EN 60749-40 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| BS EN 60749-40:2011 | Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge |
| IEC 60749-40:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge |
| CEI EN 60749-40 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| BS EN 60749-20-1:2009 | Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| NF EN 60749-40 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| I.S. EN 60749-20-1:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60749-40:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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