IEC 60749-20-1:2009
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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31-12-2021
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07-04-2009
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General applicability and reliability considerations
4.1 Assembly processes
4.1.1 Mass reflow
4.1.2 Localized heating
4.1.3 Socketed components
4.1.4 Point-to-point soldering
4.2 Reliability
5 Dry packing
5.1 Requirements
5.2 Drying of SMDs and carrier materials before being
sealed in MBBs
5.2.1 Drying requirements - level A2
5.2.2 Drying requirements - levels B2a to B5a
5.2.3 Drying requirements - carrier materials
5.2.4 Drying requirements - other
5.2.5 Excess time between bake and bag
5.3 Dry pack
5.3.1 Description
5.3.2 Materials
5.3.3 Labels
5.3.4 Shelf life
6 Drying
6.1 Drying options
6.2 Post exposure to factory ambient
6.2.1 Floor life clock
6.2.2 Any duration exposure
6.2.3 Short duration exposure
6.3 General considerations for baking
6.3.1 High-temperature carriers
6.3.2 Low-temperature carriers
6.3.3 Paper and plastic container items
6.3.4 Bakeout times
6.3.5 ESD protection
6.3.6 Reuse of carriers
6.3.7 Solderability limitations
7 Use
7.1 Floor life clock start
7.2 Incoming bag inspection
7.2.1 Upon receipt
7.2.2 Component inspection
7.3 Floor life
7.4 Safe storage
7.4.1 Safe storage categories
7.4.2 Dry pack
7.4.3 Dry atmosphere cabinet
7.5 Reflow
7.5.1 Reflow categories
7.5.2 Opened MBB
7.5.3 Reflow temperature extremes
7.5.4 Additional thermal profile parameters
7.5.5 Multiple reflow passes
7.5.6 Maximum reflow passes
7.6 Drying indicators
7.6.1 Drying requirements
7.6.2 Excess humidity in the dry pack
7.6.3 Floor life or ambient temperature/humidity exceeded
7.6.4 Level B6 SMDs
Annex A (normative) Symbol and labels for moisture-sensitive
devices
Annex B (informative) Board rework
Annex C (informative) Derating due to factory environmental
conditions
Bibliography
IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62168 and IEC PAS 62169. (04/2009) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
63
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NEN EN IEC 60749-20-1 : 2009 | Identical |
| I.S. EN 60749-20-1:2009 | Identical |
| PN EN 60749-20-1 : 2010 | Identical |
| UNE-EN 60749-20-1:2009 | Identical |
| BS EN 60749-20-1:2009 | Identical |
| CEI EN 60749-20-1 : 2010 | Identical |
| EN 60749-20-1 : 2009 | Identical |
| NF EN 60749-20-1 : 2009 | Identical |
| DIN EN 60749-20-1:2009-10 | Identical |
| PNE-prEN 60749-20-1 | Identical |
| I.S. EN 60749-37:2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| EN 62435-1:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| I.S. EN 62435-5:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| 09/30190356 DC : 0 | BS EN 60749-40 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| NF EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| IEC 62435-4:2018 | Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage |
| 05/30135664 DC : DRAFT JUN 2005 | IEC 60749-37 ED. 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD FOR HANDHELD ELECTRONIC PRODUCTS |
| CEI EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| EN 61760-4:2015/A1:2018 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
| IEC 62137-4:2014 | Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| I.S. EN 62435-1:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| BS EN 62435-1:2017 | Electronic components. Long-term storage of electronic semiconductor devices General |
| BS EN 61760-4 : 2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| CEI EN 62435-2 : 1ED 2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| CEI EN 62435-1 : 1ED 2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 12/30271778 DC : 0 | BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| BS EN 60749-37:2008 | Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer |
| I.S. EN 61760-4:2015 | SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| EN 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| OVE/ONORM EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
| IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| IEC 60749-39:2006 | Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
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