IEC 60286-5:2003+AMD1:2009 CSV
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Packaging of components for automatic handling - Part 5: Matrixtrays
Amended by
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
31-12-2021
Superseded by
Language(s)
English, English - French
Published date
27-05-2009
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.IEC 60286-5:2003+A1:2009 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. This consolidated version consists of the second edition (2003) and its amendment 1 (2009). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 40
|
| DevelopmentNote |
Stability Date: 2024. (04/2018)
|
| DocumentType |
Standard
|
| Pages |
31
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| EN 60286-5:2004/A1:2009 | Identical |
| DIN EN 60286-5:2009-09 | Identical |
| BS EN 60286-5 : 2004 | Identical |
| PN EN 60286-5 : 2005 AMD 1 2009 | Identical |
| I.S. EN 60286-5:2004 | Identical |
| UNE-EN 60286-5:2005 | Identical |
| NEN EN IEC 60286-5 : 2004 AMD 1 2009 | Identical |
| CEI EN 60286-5 : 2009 | Identical |
| I.S. EN 61188-5-2:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
| BS EN 61760-2:2007 | Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
| CEI EN 61760-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| IPC 1758 : 0 | DECLARATION REQUIREMENTS FOR SHIPPING, PACK AND PACKING MATERIALS |
| 96/202502 DC : 0 | IEC 91/95/CDV - GUIDANCE DOCUMENT FOR TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMDS) |
| CEI EN 61760-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| 09/30186180 DC : 0 | BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 61188-5-4:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| I.S. EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
| OVE/ONORM EN 61760-1 : 2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| BS ISO 21067-1:2016 | Packaging. Vocabulary General terms |
| BS EN 61188-5-4:2007 | Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides |
| BS EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
| BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
| NF EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| ISO 21067-1:2016 | Packaging Vocabulary Part 1: General terms |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| OVE/ONORM EN 61760-2 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| I.S. EN 62090:2017 | PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
| I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| 16/30333617 DC : 0 | BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
| CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 61760-2:2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 61188-5-4 : 2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
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