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IEC 60191-2:2012 DB

IEC 60191-2:2012 DB

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 2: Dimensions

Amended by

IEC 60191-2:1966/AMD21:2020

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

21-09-2012

Publisher

International Electrotechnical Committee

£378.10
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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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FOREWORD
PREFACE
Chapter 00 - PHILOSOPHY OF MECHANICAL STANDARDIZATION
Chapter 0 - RECOMMENDED VALUES FOR CERTAIN DIMENSIONS
            OF DRAWINGS OF SEMICONDUCTOR DEVICES
Chapter I - DEVICE OUTLINE DRAWINGS - TYPES OF SEMICONDUCTOR
            DEVICES GENERALLY MOUNTED IN THE PACKAGES OF
            CHAPTER I
Chapter II - BASE DRAWINGS
Chapter III - CASE OUTLINE DRAWINGS
Chapter IV - GAUGE DRAWINGS
Chapter V - TABLES SHOWING ASSOCIATIONS BETWEEN CASE OUTLINES
            AND BASES
OBSOLETE DRAWINGS -
ADDITIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2
DELETIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2

Contains more than 220 standard sheets covering device outline drawings and the types of semiconductor devices generally mounted in the packages. Published in the IEC since 1966, the drawings given in this publication represent the unification of national standards. The database version of this publication avails the standard sheets in PDF format and it also provides search facilities for easy retrieval of the drawings.
Following years subscription CHF 150.-

Committee
TC 47/SC 47D
DevelopmentNote
Also available in CD-ROM format. Also available in Database format. (09/2012) Stability Date: 2020. (09/2017) New Child IEC 60191-2 : 1.0 : AMD 21 2020 is now added
DocumentType
Standard
Pages
766
ProductNote
New Child IEC 60191-2 : 1.0 : AMD 21 2020 is now added
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

BS CECC 00802:1991 Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality
BS CECC 20005(1986) : 1986 AMD 8004 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PHOTODIODES, PHOTODIODE ARRAYS (NOT INTENDED FOR FIBRE OPTIC APPLICATIONS)
BS E9376(1976) : 1976 AMD 7597 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. VARIABLE CAPACITANCE DIODE(S)
BS IEC 60191-1:2007 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
BS CECC 50010(1983) : 1983 AMD 7591 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - AMBIENT RATED THYRISTORS
13/30284025 DC : 0 BS EN 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
BS EN 60191-3:2000 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits
BS CECC 50013(1984) : 1984 AMD 7594 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS BLANK DETAIL SPEC - CURRENT REGULATOR & CURRENT REFERENCE DIODES
BS QC 720102:1997 Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems
BS IEC 62679-1-1:2014 Electronic paper displays Terminology
BS EN 60747-16-10:2004 Semiconductor devices Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
03/117620 DC : DRAFT NOV 2003 IEC 60747-1 ED.2 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL
BS QC 750111:1991 Specification for harmonized system of quality assessment for electronic components. Semiconductor discrete devices. Blank detail specification. Bidirectional triode thyristors (triacs), ambient or case-rated, up to 100 A
OVE/ONORM EN 60191-1 : 2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
CEI EN 60191-6-13 : 2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINEPITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
I.S. EN 60191-6:2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
BS IEC 60747-1 : 2006 SEMICONDUCTOR DEVICES - PART 1: GENERAL
I.S. EN 60286-4:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV))
EN 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
EN 60603-12:1998 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
EN 61964:1999 Integrated circuits - Memory devices pin configurations
EN 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
DIN IEC 60286-3:1992-11 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING; PACKAGING OF LEADLESS COMPONENTS ON CONTINUOUS TAPES
BS EN 150012:1993 Specification for harmonized system of quality assessment for electronic components. Blank detail specification: single gate field-effect transistors
BS QC 760201:1992 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approval
BS EN 60191-6-13:2016 Mechanical standardization of semiconductor devices Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
BS CECC 50012(1978) : 1978 AMD 7593 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - SINGLE GATE FIELD EFFECT TRANSISTORS
BS EN 61964:1999 Integrated circuits. Memory devices pin configurations
BS CECC 20003(1986) : 1986 AMD 8002 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PHOTOTRANSISTORS,PHOTODARLINGTON TRANSISTORS,PHOTOTRANSISTOR ARRAYS
BS QC 760101:1992 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedure
CEI EN 60747-16-10 : 2005 SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
I.S. EN 60747-16-10:2004 SEMICONDUCTOR DEVICES - PART 16-10: TECHNOLOGY APPROVAL SCHEDULE (TAS) FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
I.S. EN 60191-1:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
BS CECC50008(1992) : 1992 AMD 7698 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BLANK DETAIL SPECIFICATION: AMBIENT RATED RECTIFIER DIODES
BS CECC50009(1992) : 1992 AMD 7699 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: CASE RATED RECTIFIER DIODES
BS 6062-3:1993 Packaging of electronic components for automatic handling Specification for packaging of leadless components on continuous tapes
CEI EN 60191-1 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
07/30162213 DC : 0 BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
BS CECC20002(1988) : 1988 AMD 8001 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: INFRARED EMITTING DIODES, INFRARED EMITTING DIODE ARRAYS
BS CECC50001(1981) : 1981 AMD 7590 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: GENERAL PURPOSE SEMICONDUCTOR DIODES
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
BS E9374(1976) : 1976 AMD 7596 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: BIPOLAR TRANSISTORS FOR SWITCHING APPLICATIONS
09/30214337 DC : 0 BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
BS IEC 60748-23-1:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification
BS QC 763000(1990) : AMD 6754 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION
BS IEC 60748-11:2000 Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits
05/30132036 DC : DRAFT APR 2005 IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA
BS EN 60191-6:2009 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60603-12:1998 Connectors for frequencies below 3 MHz for use with printed boards Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
BS 3934-1:1992 Mechanical standardization of semiconductor devices Recommendations for the preparation of drawings of semiconductor devices
BS IEC 61747-1 : 1998 AMD 10788 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION
BS CECC20006(1988) : 1988 AMD 8005 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION. PIN PHOTODIODES FOR FIBRE OPTIC APPLICATIONS
BS 3934-3:1992 Mechanical standardization of semiconductor devices Recommendations for the preparation of outline drawings of integrated circuits
BS QC790100(1991) : 1991 AMD 10586 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS
I.S. EN 61188-5-6:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
I.S. EN 60191-6-13:2016 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY (FBGA) AND FINE-PITCH LAND GRID ARRAY (FLGA)
I.S. EN 60286-3:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV))
IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
I.S. EN 60191-6-16:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
IEC 62679-1-1:2014 Electronic paper displays - Part 1-1: Terminology
IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
BS EN 150015:1993 Harmonized system of quality assessment for electronic components. Blank detail specification: unidirectional transient overvoltage suppressor diodes
12/30244653 DC : 0 BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION
01/205674 DC : DRAFT JUL 2001 IEC 60747-16-10 ED.1 - TECHNOLOGY APPROVAL SCHEDULE FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUITS
BS CECC 50011(1983) : 1983 AMD 7592 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPEC - CASE RATED THYRISTORS
IEC 61045-1:1991 Fixed film resistor networks for use in electronic equipment - Part 1: Generic specification
DIN 41870-2:1983-07 CASES FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS; SURVEY, TERMINAL COVERING
BS EN 60191-6-16:2007 Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
BS EN 60286-3:2013 Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
BS 6062-3:1988 Packaging of electronic components for automatic handling. Specification for packaging of leadless components on continuous tapes
05/30129010 DC : DRAFT FEB 2005 IEC 60191-1 ED.2 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
BS EN 60286-4:2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms
BS EN 61747-1:2000 Liquid crystal and solid-state display devices Generic specification
CEI EN 60286-4 : 2014 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS
I.S. EN IEC 60191-1:2018 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
I.S. EN 61964:2000 INTEGRATED CIRCUITS - MEMORY DEVICES PIN CONFIGURATIONS
CEI EN 60191-6 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
IEC 60603-12:1992 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 61964:1999 Integrated circuits - Memory devices pin configurations
IEC 60747-16-10:2004 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
IEC 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
05/30139061 DC : DRAFT SEP 2005 IEC 60286-3 - PACKING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
13/30284029 DC : 0 BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
CEI EN 60191-6-16 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
BS 3934-6:1992 Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages
BS E9377(1976) : 1976 AMD 7598 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: CASE RATED BIPOLAR TRANSISTORS FOR HIGH FREQUENCY AMPLIFICATION
04/30122195 DC : DRAFT SEP 2004 IEC 60747-1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL
05/30132033 DC : DRAFT APR 2005 IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
IEC 60747-4-1:2000 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification
07/30167960 DC : 0 BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
EN 60747-16-10:2004 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
EN 61747-1:1999/A1:2003 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
EN 150012 : 1991 Blank Detail Specification: Single gate field-effect transistors
BS CECC20001(1991) : 1991 AMD 8000 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: LIGHT EMITTING DIODES, LIGHT EMITTING DIODE ARRAYS, LIGHT EMITTING DIODE DISPLAYS WITHOUT INTEGRAL LOGIC AND RESISTORS
BS CECC20004(1988) : 1988 AMD 8003 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - AMBIENT RATED PHOTOCOUPLERS WITH PHOTOTRANSISTOR OUTPUT

ISO 1101:2017 Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out
ISO 370:1975 Toleranced dimensions Conversion from inches into millimetres and vice versa

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