IEC 60068-2-82:2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
23-05-2007
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
4.1 Desiccator
4.2 Humidity chamber
4.3 Thermal cycling chamber
4.4 Optical microscope
4.5 Scanning electron microscope microscopy
4.6 Fixing jig
5 Preparation for test
5.1 General
5.2 Selection of test methods
5.3 Storage conditions prior to testing
5.4 Handling of the specimen
5.5 Preconditioning by heat treatment
5.6 Specimen preparation by leads forming
6 Test condition
6.1 Ambient test
6.2 Damp heat test
6.3 Temperature cycling test
7 Test schedule
7.1 Procedure for test method selection
7.2 Initial measurement
7.3 Test
7.4 Recovery
7.5 Intermediate or final assessment
8 Information to be given in the relevant specification
9 Minimum requirements for a test report
Annex A (normative) Measurement of the whisker length
Annex B (informative) Examples of whiskers
Annex C (informative) Guidance on the sample lots and
test schedules
Annex D (informative) Guidance on acceptance criteria
Annex E (informative) Background on whisker growth
Annex F (informative) Background on ambient test
Annex G (informative) Background on damp heat test
Annex H (informative) Background on temperature
cycling test
Bibliography
IEC 60068-2-82:2007 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress.This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable.The contents of the corrigendum of December 2009 have been included in this copy.
Committee |
TC 91
|
DevelopmentNote |
Stability date: 2018. (09/2017)
|
DocumentType |
Standard
|
Pages |
32
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
OVE/ONORM EN 60068-2-82 : 2008 | Identical |
GOST R IEC 60068-2-82 : 2017 | Identical |
NF EN 60068-2-82 : 2013 | Identical |
NEN EN IEC 60068-2-82 : 2007 | Identical |
I.S. EN 60068-2-82:2007 | Identical |
PN EN 60068-2-82 : 2008 | Identical |
UNE-EN 60068-2-82:2007 | Identical |
BS EN 60068-2-82:2007 | Identical |
CEI EN 60068-2-82 : 2008 | Identical |
EN 60068-2-82:2007 | Identical |
DIN EN 60068-2-82:2007-12 | Identical |
NF EN 60512-16-21 : 2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
NF EN 60384-1 : 2016 | FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
IEC 60384-1:2016 RLV | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
09/30186180 DC : 0 | BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
BS EN 60512-16-21:2012 | Connectors for electronic equipment. Tests and measurements Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses |
BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
NF EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
14/30280850 DC : 0 | BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV)) |
EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
IEC 60512-16-21:2012 | Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses |
09/30210454 DC : DRAFT SEP 2009 | BS EN 60512-16-21 - CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
CEI EN 60512-16-21 : 2013 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
IEC 60068-3-4:2001 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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